Izimbangela zokwehluleka kwe-patch power inductor| ULULAME

Yiziphi izizathu ezithinta inductance Namuhla, ngihlanganise okuqukethwe okuhlobene ukuze ngibe yisithenjwa sakho.

Izimbangela zokuhluleka kwe-inductor

1. Ukucindezeleka komshini okukhiqizwa umgogodla kazibuthe ohlelweni lomshini kukhulu futhi akukakakhululwa.

2. Kukhona ukungcola kumongo kazibuthe noma into ewumgogodla kazibuthe ongenalutho ngokwayo ayifani, okuthinta isimo somkhakha kazibuthe wengqikithi kazibuthe futhi kuchezukise ukungeneka kwenkango kazibuthe.

3. Ngenxa yokuqhekeka kwe-sintering ngemva kokucwilisa.

4. Uma ucingo lwethusi luxhunywe nomugqa wethusi ngokucwiliswa kwe-welding, ikhoyili ifafazwa nge-liquid tin, incibilikisa i-insulation yocingo olunamelled futhi ibangele isifunda esifushane.

5. Ucingo lwethusi luncane, okuholela ekushiseleni okungamanga kanye nokwehluleka kwesekethe evulekile lapho ixhunywe ngomucu wethusi.

Imodi yokushisela

I-inductance ye-low frequency patch power inductor ikhuphuka ngaphansi kuka-20% ngemva kokuphinda kufakwe i-solder.

I-Demagnetization yenzeka ngenxa yokuthi izinga lokushisa lokugeleza kwe-reflow soldering lidlula izinga lokushisa le-Curie le-low frequency patch inductor material. Ngemuva kokukhishwa kazibuthe kwe-inductor ye-patch, ukufinyeleleka kwempahla ye-patch inductor kubuyela kubukhulu futhi i-inductance iyanda. Ibanga elijwayelekile lokulawula ukuthi i-inductance ikhuphuka ngaphansi kuka-20% ngemuva kokuthi isifaki-patch simelana nokushisa okushisela.

Inkinga ukuthi ukumelana ne-solder kungase kubangele ukuthi ngezinye izikhathi ukusebenza kwesifunda konke kufaneleka ku-welding encane ye-batch manual (lapho i-patch inductor ingashiswa ngokuphelele, i-inductance iyanda kancane). Kodwa-ke, uma kunenani elikhulu lama-chips, kutholakala ukuthi ukusebenza kwamanye amasekethe kuyancipha. Lokhu kungase kube ngenxa yokwanda kwe-inductance ye-patch ngemva kokuthengiswa kabusha kwe-reflow, okuthinta ukusebenza kwesifunda. Ezindaweni lapho ukunemba kwe-chip inductance kudingekile khona ngokuqinile (njengokwamukela isignali nokudlulisa isekethe), ukunakwa okwengeziwe kufanele kukhokhwe ukumelana nokushisela kwe-chip inductor.

Uma izinga lokushisa lokugeleza kwe-reflow soldering lifinyelelwa, isiliva lensimbi lihlangana nethayela lensimbi ukuze kwakhe i-eutectic, ngakho-ke ithini alikwazi ukucwecwa ngokuqondile ekugcineni kwesiliva kwe-patch inductor. Esikhundleni salokho, isiphetho sesiliva siqala simbozwe nge-nickel ukuze kwakhiwe ungqimba oluvikelayo, bese lufakwa ithini.

1. Qeda i-oxidation:

Uma isiqephu sithinteka ngogesi izinga lokushisa eliphezulu, umswakama, amakhemikhali, amagesi e-oxidizing, noma ligcinwe isikhathi eside kakhulu, i-Sn yensimbi ekugcineni kwe-inductor ye-patch i-oxidized ku-SnO2, futhi isiphetho se-inductor sesichibi siba mnyama. Ngenxa yokuthi i-SnO2 ayakhi i-eutectic nge-Sn, Ag, Cu, njll., ukuthengiswa kwe-patch inductance kuyehla. Impilo yeshelufu yemikhiqizo ye-patch inductor: isigamu sonyaka. Uma isiphetho se-inductance sesichibi sonakalisiwe, njengezinto ezinamafutha, izincibilikisi, njll., kuzophinde kubangele ukwehla kokuqina.

2. I-nickel coating izacile kakhulu:

Uma i-nickel plating, ungqimba lwe-nickel luncane kakhulu ukuthi lungadlala indima yokuhlukaniswa. Phakathi ne-reflow soldering, i-Sn ekupheleni kwe-inductor yesichibi isabela nge-Ag yayo kuqala, ethinta ukuncibilika ngokubambisana kwe-Sn ekugcineni kwe-inductor yesichibi kanye nokunamathisela kwe-solder ku-pad, okuholela esimweni sokudla. isiliva kanye nokwehla kokudayiswa kwe-patch inductor.

Indlela yokwahlulela: cwilisa i-inductor ye-patch ku-solder encibilikisiwe imizuzwana embalwa bese uyikhipha. Uma imigodi itholakala ekugcineni, noma ngisho nomzimba we-porcelain uvezwa, kungahlulelwa ukuthi kukhona okwenzekayo kokudla isiliva.

3. I-welding engalungile:

Uma umkhiqizo we-patch inductor une-deformation egobayo, kuzoba nomphumela wokukhulisa ngesikhathi sokushisela. I-welding engalungile, i-welding yamanga, i-pad design engafanele.

a. Zombili iziphetho zephedi kufanele zenzelwe ukugwema ubukhulu obuhlukahlukene, ngaphandle kwalokho isikhathi sokuncibilika namandla okumanzisa amaphethelo amabili azohluka.

b. Ubude bokushisela bungaphezu kuka-0.3mm (okungukuthi, ubude bokuhlangana kokuphela kwensimbi ye-patch inductor kanye nephedi).

c. Ubude bephedi buncane ngangokunokwenzeka, ngokuvamile abukho ngaphezu kuka-0.5mm.

d. Ububanzi bephedi ngokwayo akufanele bube banzi kakhulu, futhi ububanzi bayo obunengqondo akumele budlule u-0.25mm uma kuqhathaniswa nobubanzi be-MLCI.

Lapho i-patch inductance ishintsha i-engeli engu-θ ngenxa yephedi ye-solder engalingani noma ukushelela kokunamathisela kwe-solder. Ngenxa yamandla okumanzisa akhiqizwa ngesikhathi sokuncibilika kwe-welding pad, lezi zimo ezintathu ezingenhla zingase zakheke, lapho ukuzilungisa kubusa khona, kodwa ngezinye izikhathi ukudonsa kuba yi-oblique, noma iphuzu elilodwa lidonswa, futhi i-patch inductor. wadonsa phezu kwephedi, noma waze wasukuma. I-Oblique noma iqondile (isenzakalo sesikhumbuzo). Njengamanje, umshini wokubeka onokubonwa kwe-θ angle offset unganciphisa ukwenzeka kwalolu hlobo lokwehluleka.

Uma ukulinganisa kwamanje kobuhlalu obukhethiwe be-chip inductor buncane, noma uma kukhona i-impulse current enkulu kusekethe, i-current izosha futhi i-chip inductor noma ubuhlalu obuzibuthe buzohluleka, okuholela kumjikelezo ovulekile. Susa i-patch inductor ebhodini lesifunda ukuze ihlolwe, i-patch inductor iyahluleka, futhi ngezinye izikhathi kuba nezimpawu zokutubeka. Uma kwenzeka ukutubeka kwamanje, inani lemikhiqizo ehlulekile lizoba liningi, futhi imikhiqizo ehlulekile eqoqweni elifanayo ngokuvamile izofinyelela ngaphezu kuka-100%.

Ukupholisa okusheshayo nokushisa ngesikhathi sokuthengiswa kabusha kwe-reflow kubangela ukucindezeleka kwangaphakathi kwe-patch inductor, okuholela ekwandiseni iziphambeko zengxenye encane kakhulu ye-patch inductor enengozi efihliwe yokujikeleza okuvulekile, okuholela ekujikelezeni okuvulekile i-patch inductor. Susa i-patch inductor ebhodini lesifunda ukuze uhlole, i-patch inductor ayivumelekile. Uma kunesekhethi evulekile yokushisela, inani lemikhiqizo ehlulekile ngokuvamile lincane, futhi imikhiqizo ehlulekile eqoqweni elifanayo ngokuvamile ingaphansi kwamabanga ayi-1000.

Amandla kazibuthe

Umzimba we-ceramic awuqinile ngokwanele futhi uyashwabana ngenxa yokungenwa kahle kwe-patch inductor noma ezinye izizathu, noma umzimba we-porcelain wonakaliswa lapho umkhiqizo uthintwa amandla angaphandle.

Amandla okunamathela

Uma ukunamathela kwesendlalelo sesiliva sokuphela kwe-inductor kwe-patch kungalungile, lapho i-reflow soldering, i-inductor ye-patch ibanda futhi iyashisa, ingcindezi ebangelwa ukwanda okushisayo nokunciphisa okubandayo, futhi umzimba we-porcelain uthintwa amandla angaphandle. , kungenzeka ukubangela ukuhlukaniswa nokuchithwa kokuphela kwe-inductor kanye nomzimba we-porcelain; noma i-pad inkulu kakhulu, futhi lapho i-reflow soldering, amandla okumanzisa okubangelwa ukuncibilika kokunamathisela nokusabela kokuphela kukhulu kunokunamathela kokuphela, okuholela ekulimaleni kokuphela.

I-patch inductor ishisa kakhulu noma ishise eluhlaza, noma kukhona imifantu emincane enqubweni yokukhiqiza. Ukupholisa okusheshayo nokushisa ngesikhathi sokuthengiswa kabusha kwe-reflow kubangela ingcindezi ngaphakathi kwe-patch inductor, i-crystal crack, noma ukunwetshwa kwe-micro-crack, okuholela ekulimaleni kukazibuthe nokunye.